KEY FEATURES
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SMBB TechnologyBetter light trapping and current collection to improve module power output and reliability -
PID ResistanceExcellent Anti-PID performance guarantee viaoptimized mass-production process and materials control. -
Higher Power OutputModule power increases 5-25% generally,bringing significantly lower LCOE and higher IRR -
Hot 2.0 TechnologyThe N-type module with Hot 2.0 technology has better reliability and lower LID/LETID -
Enhanced Mechanical LoadCertified to withstand: wind load (2400 Pascal) and snow load (5400 Pascal)
